"Stress Migration of Aluminum Backside Interconnect in Xtacking®."

Kang Yang et al. (2023)

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DOI: 10.1109/IRPS48203.2023.10117817

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type: Conference or Workshop Paper

metadata version: 2023-05-24

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Kang Yang, Suhui Yang, Yan Ouyang, Shengwei Yang, Kun Han, Yi He:
Stress Migration of Aluminum Backside Interconnect in Xtacking®. IRPS 2023: 1-4

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