"Random walk based capacitance extraction for 3D ICs with cylindrical ..."

Wenjian Yu et al. (2014)

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DOI: 10.1109/ICCAD.2014.7001429

access: closed

type: Conference or Workshop Paper

metadata version: 2025-12-07

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Wenjian Yu, Chao Zhang, Qing Wang, Yiyu Shi:
Random walk based capacitance extraction for 3D ICs with cylindrical inter-tier-vias. ICCAD 2014: 702-709

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