"Microstructure and reliability of hybrid interconnects by Au stud bump ..."

Hongjun Ji, Jiao Wang, Mingyu Li (2016)

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DOI: 10.1016/J.MICROREL.2016.10.003

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type: Journal Article

metadata version: 2020-02-22

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Hongjun Ji, Jiao Wang, Mingyu Li:
Microstructure and reliability of hybrid interconnects by Au stud bump with Sn-0.7Cu solder for flip chip power device packaging. Microelectron. Reliab. 66: 134-142 (2016)

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