Hiroshi Toshiyoshi

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Eiji Higurashi

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Publications

2022
[c16]
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Masahide Goto, Yuki Honda, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto:
3-Layer stacked pixel-parallel CMOS image sensors using hybrid bonding of SOI wafers. Imaging Sensors and Systems 2022: 1-4
2019
[c14]
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  - conf/3dic/GotoVWHNIHHSKTH19
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Masahide Goto, Joeri De Vos, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi, Eiji Higurashi, Yuki Honda, Takuya Saraya, Masaharu Kobayashi, Hiroshi Toshiyoshi, Toshiro Hiramoto:
Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers. 3DIC 2019: 1-4
2018
[c13]
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  - conf/iscas/GotoHWHNISKHTH18
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Masahide Goto, Yuki Honda, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto:
Quarter Video Graphics Array Full-Digital Image Sensing with Wide Dynamic Range and Linear Output Using Pixel-Wise 3D Integration. ISCAS 2018: 1-4
2015
[c6]
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  - conf/3dic/GotoHIOSKHTH15
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Masahide Goto, Kei Hagiwara, Yoshinori Iguchi, Hiroshi Ohtake, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto:
Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers. 3DIC 2015: TS9.2.1-TS9.2.4

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